Dongguan MENTO Intelligent Technology Co., Ltd.
Manufacturer of industrial production line inspection equipment
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| Model | RD30K | |
| Basic Function | Function | Defective die removing, residues cleaning, solder paste/adhesive printing, die bonding, solder curing, luminescence inspection |
| Wafer size | 3x5mil-20x20mil | |
| Substrate compatibility | FR-4, BT substrate, glass substrate, FPC, etc. | |
| Maximum board size | 380mmx280mm | |
| Removing | Removing,method | Physical |
| Residue cleaning | Direct removal + heating suction | |
| Height measurement | Laser measurement 0.001mm | |
| Printing | Motion | XYZ (linear way) |
| Adhesive compatibility | Solder Paste, Flux | |
| Chip correction | Correction method | Rotation |
| Correction angle accuracy | ±2° | |
| Mounting | Mounting head | Surface suction |
| Mounting strength | 25g-210g | |
| Mounting accuracy | ±10μm | |
| Curing | Curing method | Laser, heat curing |
| Inspection | Inspection items | R, G, B luminescence inspection |
| Chip table | Accuracy | ±0.3 mil |
| Re-measurement accuracy | ±0.2 mil | |
| Die attach film size | 6" | |
| Number of die attach films | 4PCS | |
| Ejector stroke | 2mm(max) | |
| Specification | UPH | ≤30s/pc |
| Power | 220V±10V,50Hz,5KW | |
| Dimensions | W1300xD1600xH1650mm | |
| Weight | 1500KG | |
Pad measurement/Pad inspection /Solder paste printer/SPI/Die bonder/Pre-reflow AOI/Reflow oven/Post-reflow AOI /
Luminescence in spection/Colloid inspection/Laser Marker/Rework
Multiple die attach films system enables fast processing and RGB chips switching.
The transmission fixture table adopts bilateral clamping to avoid manual line change and has strong versatility.
Dual worktables enable non-stop, cyclic work.
Height measurement module.