Dongguan MENTO Intelligent Technology Co., Ltd.
Manufacturer of industrial production line inspection equipment
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Testing Program
Gold Wire lnspection:
Gold Ball Size, Solder Joint Offset,Eccentric Ball GolfSolder Joint Non-Stick, Solder Joint Bridging, Missing BallPlanting, Solder Joint Adhesion, Solder Joint Foreign Objects,Loss ofAluminum, Overlapping Solder Joints, Damaged Protective Coating,BrokenSolder Joints, Loss of Gold in Gold Fingers, Large Flat Balls,Unsoldered←
Wires, soldering wrong wires, missing soldering wires, broken wires,
wires stepping, wires bridging, gold wires remaining, soldering wires
interlacing, dumping wires;
Chip Inspection
Wafer Chip Inspection
Wafer Chip Inspection
Semiconductor package testing equipment
Dual-track design method (vision & marking are both dual-track single head)
Ultra-high precision whole-plate image technology
based on whole-plate seamless splicing technology realizes high-precision quantitative value metrology such as offset and angle covariance.
μ-level metrology control capability
closed-loop control system to ensure positional accuracy <1um.
Electronic IO control
long service life, stable and noiseless; LED light status indication.
Vision Systems
Industrial Camera
High-speed multi-frame industrial digital cameras are used.
Telecentric Optical System
High depth of field, low distortion, full pixel, fixed resolution design.
Constant Current Light Source Controller
Full closed-loop constant current digital controller to ensure the stability and uniformity of light source brightness.
Process control SPC
1. Statistics of CPK, average value, extreme deviation, standard deviation, large value, small value of the product.
2. Customizable control chart of the loss of control rules, and alarm prompts.
3. Record the cause of the out-of-control point and processing measures, saved in the database.
Technical Parameters
| Device model | ST-2000L | |
| Detection capacity | Detection items | Solder joint offset, non-stick solder joint, bridging, missed ball placement, foreign matter, aluminum loss, overlapping solder joints, damaged protective layer, missing solder wires, wrong wires, broken wires, staggered wires, thrown wires, etc. |
| Detection element | 0.7mil | |
| Detection method | Algorithm parameter tuning, machine learning | |
| Optical system | Camera | U3, Pixel:4504*4504(20 million) |
| Telecentric lens | High resolution dual side telecentric optics | |
| Resolution | 4μ | |
| FOV | 21*14mm | |
| Light Source | Coaxial red light + high angle blue light + low angle blue light | |
| Efficiency | 0.23S/FOV | |
| Computer configuration | Host | CPU:Inteli7, Memory:DDR4-64G, GPU:GTX1060-6G, SSD:SSD-120G, Mechanical HDD:2T |
| Monitor | CPU:Inteli7, Memory:DDR4-64G, GPU:GTX1060-6G, SSD:SSD-120G, Mechanical HDD:2T | |
| Operating system | Windows10-64 Professional Edition | |
| Detection performance | PCB Thickness | 0.3-5mm |
| Component Height | Upper 30mm, lower 80mm (special height can be customized) | |
| Driving equipment | Servo motor + ball screws + linear guides | |
| Moving speed | Max:600mm/sec | |
| Fixture height | 950±50mm(from floor to fixture surface) | |
| Parameters | size | Max:L300*W100 mm(single track, track width adjustable) |
| Power | AC220V/50Hz/2000W | |
| Overall size | L:1400 mm W:1450 mm H:1650 mm (without alarm light) | |
| Transmission method | Magnetic Wheel Structure | |
| Weight | ≈1800Kg | |
| Upstream and downstream equipment communication | Standard SMEMA interface / and solid crystal machine data communication | |
| Maintenance service | Warranty: 1 year, software upgrade free of charge | |