
Add to Cart
Down-illuminated AOI
1. High detection, low misjudgment
2. Unique chain track
3. Rich detection algorithms can effectively target DIP defects
4. Two-person re-judgment repair stations can be implemented according to the inspection ratio.
Application scope: solder joint and mounted device inspection
Device model | K2005DW | |
Detection capacity | Detection items | CHIP component body, CHIP component solder joints, characters, DIP solder joints |
Smallest component | CHIP:0201 Pitch:0.3mm | |
Detection method | Algorithm parameter debugging, machine learning | |
Optical system | Camera | 5MP high speed color industrial camera |
Telecentric lens | 0.22X/0.17X | |
Resolution | 15um/20um/25um | |
FOV | 36x30mm/48x40mm/61x51mm | |
Detection speed | 3FOV/s | |
Software system | Operating system | Windows 10 |
Mechanical property | PCB Thickness | 0.3~10mm(warpage≤5mm) |
Component Height | 180mm upper, 30mm lower (special height can be customized) | |
Driving equipment | Servo motor + ball screw + linear slide | |
Moving speed | Max.600mm/s | |
Positioning accuracy | ≤8um(after calibration) | |
PCB transport rail | PCB rail transportation height: 900±20mm (from the ground to the PCB guide rail transportation surface) | |
PCB maximum size: 510mmx460mm | ||
PCB minimum spacing: ≤90mm | ||
Parameters | Power source | AC220V/50Hz/2000W |
Overall size | W1140mmxD1400mmxH1600mm (excluding foot 100±20mm) | |
Weight | ≈700KG | |
Air Pressure | ≥0.5MPa | |
Environmental requirements | Temperature: 5~40℃, relative humidity 25%~80% (no frost) | |
Upstream and downstream equipment communication | Standard SMEMA interface |